Titán Agilex

Key Features and Specifications

• High Payload Capacity: Supports a substantial 300 kg payload, making it suitable for carrying heavy equipment or large sensor arrays.
• Off-Road Capability: Engineered to operate reliably in harsh, extreme environments, it features a robust chassis with adaptive front swing arms and rear shock absorbers to enhance stability, driving, and cornering on difficult surfaces (wet, slick, loose, uneven, steep hills).
  • Max Obstacle Clearance: 120 mm
  • Max Climbing Ability: 10∘
• Steering & Maneuverability: Equipado con Front and Rear Ackermann Steering for superior maneuverability and control.
• Power System: Utilizes a Lithium Battery (48V 24Ah, with support for two batteries) and features a hot-swappable, dual-sided portable battery compartment to minimize downtime through quick-charging and easy replacement.
  • Parking: Cuenta con una DC Electromagnetic Brake for secure parking.
• Conectividad: ROS-compatible (Robot Operating System) with communication via CAN bus y RS-232 interfaces, facilitating integration with various sensing and control systems for autonomous operation and development.

Intel Agilex 7 FPGAs with F-Tile (Often called “Titan” in reference to the fast F-Tile)

El Intel Agilex 7 FPGAs with F-Tile are ultra-high-performance Field-Programmable Gate Arrays developed by Intel (now Altera). The “Titan” reference is often used colloquially to highlight the extreme speed and capabilities of the F-Tile transceivers integrated into this series, which are crucial for demanding bandwidth-intensive applications.

Key Features and Capabilities

• Industry-Leading Transceiver Performance: Features the integrated F-Tile architecture which delivers the fastest FPGA transceivers on the market, supporting data rates up to 116 Gigabits per second (Gbps).
• High-Bandwidth Networking: Offers hardened 400 Gigabit Ethernet (GbE) Intellectual Property (IP), enabling flexible, high-density, and high-speed connectivity from 10G up to 400G Ethernet rates.
• Process Technology: Built on Intel’s advanced 10 nm SuperFin process technology for improved power efficiency and performance.
• Aplicaciones versátiles: Designed for applications across the most bandwidth and compute-intensive areas, including:
  • Data Centers (accelerators, IPUs)
  • Networking (400 Gbps to 1.6 Tbps optical networking, 5G networks)
  • Broadcast (HDMI, SDI standards)
  • Embedded and Edge Computing
• Architectural Advantages: Soportes PCIe 5.0 y Compute Express Link (CXL), allowing for high-speed host-device connectivity and memory coherence across heterogeneous systems.
• Flexibility and Integration: The FPGAs offer a high degree of customizability and heterogeneous integration, allowing developers to create custom chip designs by leveraging hardened IP blocks alongside the programmable FPGA fabric.